Nanoscale conductive connectors and method for making same

Etching a substrate: processes – Planarizing a nonplanar surface

Reexamination Certificate

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C423S447300, C423S460000, C423S44500R

Reexamination Certificate

active

06322713

ABSTRACT:

FIELD OF THE INVENTION
This invention relates to conductive connecting elements and, in particular, to nanoscale connectors for microdevices such as integrated circuit components and to methods for making such connectors.
BACKGROUND OF THE INVENTION
As integrated circuits become smaller, structures for electrically connecting microscopic electronic devices become increasingly important. Integrated circuits can now be made with hundreds of thousands of devices of submicron dimension requiring at least as many conductive interconnections among the devices and hundreds of interconnections with packaging leads. As the circuits become smaller and more complex, the difficulties of making sufficiently small, uniform metal wires and metal stripes become increasingly a limitation on circuit design and performance. The standard gold wires used to bond IC pads to package leads are relatively bulky, limiting the minimum size of IC bonding pads, and the metal stripes used to interconnect microdevices within an IC are subject to cross sectional nonuniformities. Accordingly there is a need for nanoscale connectors which provide high, uniform conduction.
SUMMARY OF THE INVENTION
In accordance with the invention, nanoscale connectors particularly useful for connecting microscale devices comprise free-standing nanoscale conductors. The nanoscale conductors are conveniently fabricated in sets of controlled, preferably equal length by providing a removable substrate, growing conductive nanotubes or nanowires on the substrate, equalizing the length of the nanoscale conductors, and removing the substrate. Preferably the removable substrate is soluble, leaving a collection of free standing nanoscale connectors in suspension or solution.


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