Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material
Reexamination Certificate
2007-07-02
2011-10-18
Dickey, Thomas L (Department: 2893)
Semiconductor device manufacturing: process
Coating with electrically or thermally conductive material
C257SE21174, C257SE21582
Reexamination Certificate
active
08039379
ABSTRACT:
Functionalized nanoparticles are deposited on metal lines inlaid in dielectric to form a metal cap layer that reduces electromigration in the metal line. The functionalized nanoparticles are deposited onto activated metal surfaces, then sintered and annealed to remove the functional agents leaving behind a continuous capping layer. The resulting cap layer is about 1 to 10 nm thick with 30-100% atomic of the nanoparticle material. Various semiconductor processing tools may be adapted for this deposition process without adding footprint in the semiconductor fabrication plant.
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Alers Glenn
Havemann Robert H.
Dickey Thomas L
Novellus Systems Inc.
Weaver Austin Villeneuve & Sampson LLP
Yushin Nikolay
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