Nanolaminated thin film circuitry materials

Details Nanolaminated thin film circuitry materials Nanolaminated thin film circuitry materials

1999-10-27

2001-04-03

Lam, Cathy (Department: 1775)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S766000, C428S209000

Reexamination Certificate

active

06212078

ABSTRACT:

The present invention is directed to thin film laminates used to form electronic circuitry that includes both resistors and capacitors, and to a method of manufacture of such structures.
BACKGROUND OF THE INVENTION
There is a continuing interest in printed circuitry miniaturization. In most printed circuit boards in use, circuitry traces are printed by conventional methods, particularly photoresist techniques. Accessory components such as capacitors and resistors are frequently provided as discrete components and soldered onto the printed circuitry, either manually or robotically. These components occupy “real estate” on the printed circuit board and may be difficult or expensive to apply to the board.
Accordingly, structures have been proposed in which components such as capacitors and/or resistors are provided along with circuitry traces by circuitization procedures. Examples of such structures are found in U.S. Pat. Nos. 5,079,069, 5,155,655, 5,161,086, 5,261,153, 5,347,258, and 5,466,892, the teachings of each of which are incorporated herein is by reference. Typically, a plurality of such structures are laminated together with dielectric material to form multi-layer printed circuit boards.
The present invention is directed to a method of forming a thin, circuitized laminate structure that provides both capacitors and resistors, and to the thin layer circuitized laminate structure formed therefrom.
SUMMARY OF THE INVENTION
The present invention is directed to nanolaminated structures for forming passive electronic components including capacitors and resistors and to circuitized laminates which provide both capacitors and resistors. In its simplest form, a laminate in accordance with the invention comprises a layer of resistive material and a layer of dielectric material. Preferably, the laminate comprises three or more layers of resistive material alternating with two or more layers of dielectric material. Such laminates may be connected to electrical connects so as to form both capacitors and resistors.


REFERENCES:
patent: 4574255 (1986-03-01), Fujii et al.
patent: 4799128 (1989-01-01), Chen
patent: 5079069 (1992-01-01), Howard et al.
patent: 5155655 (1992-10-01), Howard et al.
patent: 5161086 (1992-11-01), Howard et al.
patent: 5261153 (1993-11-01), Lucas et al.
patent: 5311406 (1994-05-01), Snodgrass et al.
patent: 5347258 (1994-09-01), Howard et al.
patent: 5466892 (1995-11-01), Howard et al.
patent: 5574630 (1996-11-01), Kresge et al.
patent: 5652021 (1997-07-01), Hunt et al.
U.S. application No. 09/067,975, Hunt et al., filed Apr. 29, 1998.
U.S. application No. 09/198,285, Hunt et al., filed Nov. 23, 1998.
U.S. application No. 00/198,954, Hunt et al., filed Nov. 24, 1998.

Affiliated with

Also associated with

Rating

Nanolaminated thin film circuitry materials does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Nanolaminated thin film circuitry materials, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Nanolaminated thin film circuitry materials will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2458542