Synthetic resins or natural rubbers -- part of the class 520 ser – Synthetic resins – At least one aryl ring which is part of a fused or bridged...
Reexamination Certificate
2008-01-01
2008-01-01
Buttner, David J. (Department: 1796)
Synthetic resins or natural rubbers -- part of the class 520 ser
Synthetic resins
At least one aryl ring which is part of a fused or bridged...
C524S394000, C524S398000, C524S399000, C524S400000, C524S445000, C524S556000, C473S372000, C473S373000
Reexamination Certificate
active
11068444
ABSTRACT:
A golf ball comprising a core, an intermediate layer, and a cover. The core, which has a compression of 100 or less and a diameter of between about 1.00 inches and about 1.64 inches, is formed from a first polymer including an acid group fully-neutralized by a salt of an organic acid, a cation source, or a suitable base of the organic acid; and a nano-material having an average particle size of 100 nm or less, present in an amount sufficient to adjust at least one material property of the first polymer by 5% to 50% when compared to the material property of the first polymer comprising a material identical to the nano-material but having an average particle size greater than 1000 nm. The intermediate layer is formed from a second polymer comprising an acid group fully-neutralized by a salt of an organic acid, a cation source, or a suitable base of the organic acid.
REFERENCES:
patent: 4091083 (1978-05-01), Hirschvogel
patent: 4611810 (1986-09-01), Kamata
patent: 4877501 (1989-10-01), Schnur et al.
patent: 4895713 (1990-01-01), Greinke et al.
patent: 4911981 (1990-03-01), Schnur et al.
patent: 4990291 (1991-02-01), Schoen et al.
patent: 5006297 (1991-04-01), Brown et al.
patent: 5028674 (1991-07-01), Hatch et al.
patent: 5334673 (1994-08-01), Wu
patent: 5484870 (1996-01-01), Wu
patent: 5580927 (1996-12-01), Chou et al.
patent: 5692974 (1997-12-01), Wu et al.
patent: 5703166 (1997-12-01), Rajagopalan et al.
patent: 5733428 (1998-03-01), Calabria et al.
patent: 5824746 (1998-10-01), Harris et al.
patent: 5885172 (1999-03-01), Hebert et al.
patent: 5908358 (1999-06-01), Wu
patent: 5919100 (1999-07-01), Boehm et al.
patent: 5981658 (1999-11-01), Rajagopalan et al.
patent: 6001930 (1999-12-01), Rajagopalan
patent: 6025442 (2000-02-01), Harris et al.
patent: 6124389 (2000-09-01), Cavallaro et al.
patent: 6142887 (2000-11-01), Sullivan et al.
patent: 6150462 (2000-11-01), Rajagopalan et al.
patent: 6162135 (2000-12-01), Bulpett et al.
patent: 6180040 (2001-01-01), Ladd et al.
patent: 6180722 (2001-01-01), Dalton et al.
patent: 6187864 (2001-02-01), Rajagopalan
patent: 6193619 (2001-02-01), Wu et al.
patent: 6204331 (2001-03-01), Sullivan et al.
patent: 6207784 (2001-03-01), Rajagopalan
patent: 6221960 (2001-04-01), Rajagopalan
patent: 6232400 (2001-05-01), Harris et al.
patent: 6245862 (2001-06-01), Rajagopalan
patent: 6280759 (2001-08-01), Price et al.
patent: 6290611 (2001-09-01), Rajagopalan et al.
patent: 6291592 (2001-09-01), Bissonnette et al.
patent: 6353058 (2002-03-01), Rajagopalan
patent: 6414082 (2002-07-01), Rajagopalan et al.
patent: 6454666 (2002-09-01), Shira
patent: 6458895 (2002-10-01), Wrigley et al.
patent: 6465578 (2002-10-01), Bissonnette et al.
patent: 6476130 (2002-11-01), Rajagopalan et al.
patent: 6485378 (2002-11-01), Boehm
patent: 6494795 (2002-12-01), Sullivan
patent: 6653382 (2003-11-01), Statz et al.
patent: 6710114 (2004-03-01), Bissonnette et al.
patent: 6793592 (2004-09-01), Sullivan et al.
patent: 6794447 (2004-09-01), Kim et al.
patent: 6808461 (2004-10-01), Harris et al.
patent: 6919395 (2005-07-01), Rajagopalan et al.
patent: 2001/0024982 (2001-09-01), Cavallaro et al.
patent: 2001/0056197 (2001-12-01), Albert et al.
patent: 2002/0086745 (2002-07-01), Rajagopalan
patent: 2003/0050373 (2003-03-01), Chen
patent: 2003/0100656 (2003-05-01), Majumdar et al.
patent: 2003/0114565 (2003-06-01), Chen et al.
patent: 2003/0130061 (2003-07-01), Rajagopalan et al.
patent: 2003/0144087 (2003-07-01), Rajagopalan et al.
patent: 2004/0018895 (2004-01-01), Bulpett et al.
patent: 2004/0092336 (2004-05-01), Kim et al.
patent: 2005/0003180 (2005-01-01), Kondos
patent: 2005/0059756 (2005-03-01), Kim et al.
patent: 11-244419 (1999-09-01), None
patent: WO 00/23519 (2000-04-01), None
patent: WO 01/29129 (2001-04-01), None
patent: WO 01/43832 (2001-06-01), None
patent: WO 02/02193 (2002-01-01), None
patent: WO 02/09823 (2002-02-01), None
Dagani, R. “Building From the Bottom Up,” Chemical & Engineering News, Oct. 16, 2000, p. 27.
Sherman, L. M. “Nanocomposites a Little Goes a Long Way,” Plastics Technology, Jun. 1999, p. 52.
Dagani, R. “Putting the ‘Nano’ Into Composites,” Science/Technology, Jun. 7, 1999, vol. 77, No. 23, pp. 25-37.
Petrovic, Z. S.; Javni, I.; Waddon, A. “Polyurethane Elastomers With Nano-Fillers”, Conference Proceedings at ANTEC 1998, Atlanta, Georgia, Apr. 26, 1998, p. 225.
Kressler, J.; Thomann, R. “Nanocomposites Based on a Synthetic Layer Silicate and Polyamide-12,” Conference Proceedings at ANTEC 1998, Atlanta, Georgia, Apr. 26, 1998, p. 447.
Haddad, T. S.; Schwab, J.; Mather, P. T.; Romo-Uribe, A.; Otonari, Y.; Carr, M. J.; Lichtenhan, J. D. “The Rational Design of Silsesquioxane-Based Polymers”, Conference Proceedings at ANTEC 1997, Toronto, Canada, Apr. 27, 1997, vol. II-Materials, p. 1814.
Novak, B. M.; Ellsworth, M.W.; Verrier, C. “Organic-Inorganic Nanocomposite Materials. Mechanical and Thermal Properties,” Polymeric Materials Science and Engineering, American Chemical Society Spring Meeting, 1994, San Diego, California, vol. 70, p. 266.
Rajagopalan Murali
Sullivan Michael J.
Acushnet Company
Buttner David J.
Lacy William B.
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