Nano-imprinting process

Details Nano-imprinting process Nano-imprinting process

2011-06-07

2011-06-07

Johnson, Christina (Department: 1742)

Plastic and nonmetallic article shaping or treating: processes

Mechanical shaping or molding to form or reform shaped article

Deforming the surface only

C977S887000

Reexamination Certificate

active

07955545

ABSTRACT:
A nano-imprinting process is described, comprising: providing a substrate including an imprinting material layer covering a surface of the substrate; providing a mold including protruding features set on a surface of the mold covered with an anti-adhesion layer; forming a transferring material layer on a top surface of each protruding feature; embedding the transferring material layer into a first portion of the imprinting material layer; removing the mold and separating the mold and the transferring material layer simultaneously to transfer the transferring material layer into the first portion of the imprinting material layer and to expose a second portion of the imprinting material layer; using the transferring material layer as a mask to remove the second portion of the imprinting material layer and a portion of the substrate; and removing the first portion of the imprinting material layer and the transferring material layer.

REFERENCES:
patent: 4211834 (1980-07-01), Lapadula et al.
patent: 4680085 (1987-07-01), Vijan et al.
patent: 4791046 (1988-12-01), Ogura
patent: 5278008 (1994-01-01), Moss et al.
patent: 2003/0175427 (2003-09-01), Loo et al.
patent: 2005/0173717 (2005-08-01), Lee et al.
patent: 2006/0258163 (2006-11-01), Ohashi et al.
Suh, D., J. Rhee, H.H. Lee, Bilayer reversal imprint lithography: direct metal-polymer transfer, Nanotechnology, vol. 15 (2004), pp. 1103-1107.
Chien, C.H., H.M. Yu, The novel fabrication of multi-metal layers embedded in PMMA polymer materials, J. of Materials Processing Technology, Vo. 187-188 (2007), pp. 314-317. Available online Feb. 12, 2007.
J. Rhee and H.H. Lee, Patterning organic light-emitting diodes by cathode transfer, Applied Physics Letters, vol. 81, No. 22 (2002), pp. 4165-4167.
N. Kehagias, et al., Submicron three-dimensional structures fabricated by reverse contact UV nanoimprint lithography, J. Vac. Sci. Technol. B, vol. 24, No. 6 (2006), pp. 3002-3005.
J. Zaumseil, et al., Three-Dimensional and Multilayer Nanostructures Formed by Nanotransfer Printing, Nano Letters, vol. 3, No. 9 (2003), pp. 1223-1227.
D. Suh, S.-J. Choi, H.H. Lee, Rigiflex Lithography for Nanostructure Transfer, Advanced Materials, vol. 17 (2005), pp. 1554-1560.
Nakamatsu et al., “Nanoimprint and Nanocontact Technologies Using Hydrogen Silsesquioxane”, Apr. 2005, J. Vac. Sci. Technol. B 23(2), p. 507-512.
Xia, et al., “Soft Lithography”, Annu. Rev. Mater. Sci. 1998.28: 153-84.
Wolfe, et al., “Fabrication of Planar Optical Waveguides by Electrical Microcontact Printing”, Appl. Phys. Lett., vol. 84, No. 10, Mar. 8, 2004, 1623-1625.
Xia, et al., “Microcontact Printing of Octadecylsiloxane on the Surface of Silicon Dioxide and its Application in Microfabrication”, J. Am. Chem. Soc. 1995, 117, 9576-9577.
Suh, Dongchul et al, “Bilayer reversal imprint lithography: direct metal-polymer transfer”, Nanotechnology, Jun. 30, 2004, pp. 1103-1107, vol. 15, Institute of Physics Publishing, UK.

Affiliated with

Also associated with

Rating

Nano-imprinting process does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Nano-imprinting process, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Nano-imprinting process will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2744922