Metal treatment – Stock – Copper base
Reexamination Certificate
2003-10-16
2010-06-15
Ip, Sikyin (Department: 1793)
Metal treatment
Stock
Copper base
C148S433000, C148S434000, C148S435000, C148S436000, C420S469000, C420S470000, C420S471000, C420S472000, C420S473000, C420S474000, C420S475000, C420S476000, C420S477000, C420S478000, C420S479000, C420S480000, C420S481000, C420S482000, C420S483000, C420S484000, C420S485000, C420S486000, C420S487000, C420S488000, C420S489000, C420S490000, C420S491000, C420S492000, C420S493000, C420S494000, C420S495000, C420S496000, C420S497000, C420S498000, C420S499000, C420S500000
Reexamination Certificate
active
07736448
ABSTRACT:
The present invention relates to a nanocrystalline metallic material, particularly to nano-twin copper material with ultrahigh strength and high electrical conductivity and its preparation method. High-purity polycrystalline Cu material with a microstructure of roughly equiaxed submicron-sized grains (300-1000 nm) has been produced by pulsed electrodeposition technique, by which high density of growth-in twins with nano-scale twin spacing were induced in the grains. Inside each grain, there are high densities of growth-in twin lamellae. The twin lamellae with the same orientations are inter-parallel, and the twin spacing ranges from several nanometers to 100 nm with a length of 100-500 nm. This Cu material invented has more excellent performance than existing ones. The tensile yield strength and ultimate strength of the present Cu material at room-temperature can be as high as 900 MPa and 1086 MPa, respectively, and such a high tensile strength can not be achieved for the Cu materials with the same chemical composition prepared by any traditional methods. Meanwhile, the present Cu sample also keeps a good electrical conductivity, for example, the room-temperature resistivity is (1.75±0.02)×10−8Ω·m, corresponding to 96% IACS, which is close to that of the conventional coarse-grained Cu.
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Abstract for CN 1389597 having a publication date of Jan. 8, 2003 for invention entitled “High-strength and high-conductivity nanometer crystal copper material and its prepn”.
Lu Ke
Lu Lei
Shen Yongfeng
Si Xiao
Institute of Metal Research Chinese Academy of Sciences
Ip Sikyin
Smith , Gambrell & Russell, LLP
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