Nano and meso shell-core control of physical properties and...

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Reexamination Certificate

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C428S324000, C428S328000, C428S329000, C428S330000, C428S331000, C428S413000, C428S537500

Reexamination Certificate

active

07851059

ABSTRACT:
A high thermal conductivity resin that is made up of a host resin matrix (42) and high thermal conductivity fillers (30) that are mixed within the host resin to form a resin mixture. The fillers comprise at least 3-5% by weight of the resin mixture, and the fillers are from an average of 1-100 nm in at least one dimension, and where the particles are smaller than an average of 1000 nm in the particles' longest dimension. The host resin matrix forms an ordered resin shell (40) around the high thermal conductivity fillers (30), whereby resin molecules are aligned perpendicular to the surface of the high thermal conductivity fillers. An overlap of the ordered resin shells (44) is formed between the high thermal conductivity fillers such that continuous pathways for ordered resin shells are created through the resin mixture.

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