Mutliple lamination high density interconnect process and struct

Details Mutliple lamination high density interconnect process and struct Mutliple lamination high density interconnect process and struct

1990-07-02

1992-10-20

Picard, Leo P.

Electricity: electrical systems and devices

Miscellaneous

H05K 111

Patent

active

051575892

ABSTRACT:
A high density interconnect structure incorporating a plurality of laminated dieletric layers is fabricated using thermoplastic adhesive layers of progressively lower glass transition temperature in order to maintain the stability of the already fabricated structure during the addition of the later laminations. This structure also facilitates the removal of only a portion of the high density interconnect structure where a fault in the system can be corrected in one of the upper layers of the high density interconnect structure.

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