Mushroom casing composition and process

Details Mushroom casing composition and process Mushroom casing composition and process

1980-04-18

1982-07-06

Smith, William F.

Plant husbandry

Mushroom culture

71 5, 264 453, 521 68, A01G 104

Patent

active

043375944

ABSTRACT:
In the cultivation of mushrooms from an underlying bed containing mushroom spores, novel compositions and processes are provided for a casing layer which is placed over the compost layer containing spawning mycelium. A hydrophilic, thermosetting prepolymer resin is mixed in with a casing substrate, preferably Canadian peat, other optional additives and sufficient amount of water to form a slurry, and the mixture is allowed to cure to a spongy block. The cured material is then pulverized and deposited as a casing layer over the compost layer. Because of the high water retention qualities of this material, watering the mushroom beds is reduced by a factor of three or more, thereby reducing operation and production costs, as also the incidence and severity of disease and displeasing blemishes.

REFERENCES:
patent: 3519413 (1970-07-01), Trimbach et al.
patent: 3812615 (1974-05-01), Jamison
patent: 3838075 (1974-09-01), Dietrich et al.
patent: 3929198 (1976-09-01), Bardsley
patent: 4079543 (1978-03-01), Stoller
patent: 4221749 (1980-09-01), Dedolph
patent: 4278625 (1981-07-01), Dedolph

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