Mushroom casing composition and process

Details Mushroom casing composition and process Mushroom casing composition and process

1982-04-14

1984-04-24

Bagwill, Robert E.

Plant husbandry

Mushroom culture

71 5, A01G 104

Patent

active

044439695

ABSTRACT:
In the cultivation of mushrooms from an underlying bed containing mushroom spores, novel compositions and processes are provided for a casing layer which is placed over the compost layer containing spawning mycelium. A hydrophilic, thermosetting prepolymer resin is mixed in with a casing substrate, preferably Canadian peat, other optional additives and sufficient amount of water to form a slurry and the mixture is allowed to cure to a spongy block. The cured material is then pulverized and deposited as a casing layer over the compost layer. Because of the high water retention qualities of this material, watering the mushroom beds is reduced by a factor of three or more, thereby reducing operation and production costs, as also the incidence and severity of disease and displeasing blemishes.

REFERENCES:
patent: 4337594 (1982-07-01), Hanacek et al.

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