Multistage mounting printed circuit board system and method

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

Reexamination Certificate

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C361S788000, C361S736000

Reexamination Certificate

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10758982

ABSTRACT:
A multi stage mounting printed circuit board system and method is presented. In one embodiment, a multi stage mounting printed circuit board system includes a first printed circuit board for mounting electrical components on. A first printed circuit board interface component is coupled to the first printed circuit board. The first printed circuit board interface component communicatively couples the first printed board to a second printed board via a second printed circuit board interface component. A plurality of printed circuit board extractors are coupled to the first printed circuit board. The plurality of printed circuit board extractors couple the first printed circuit board to card guides (e.g., a single pair of card guides in which the second printed circuit board is mounted).

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patent: 5031074 (1991-07-01), Ravid
patent: 6137684 (2000-10-01), Ayd et al.
patent: 6511139 (2003-01-01), Liu
patent: 6625035 (2003-09-01), Steinman et al.
patent: 6822874 (2004-11-01), Marler
patent: 6904482 (2005-06-01), Rietze et al.
patent: 6950311 (2005-09-01), DeCesare et al.

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