Multiprobing semiconductor test method for testing a plurality o

Electricity: measuring and testing – Fault detecting in electric circuits and of electric components – Of individual circuit component or element

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G01R 3102

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active

056940505

ABSTRACT:
The purpose of the test method is to improve test efficiency in a semiconductor test method utilizing multiprobing. The semiconductor test method involves placing probes into contact with the electrode pads of semiconductor chips on a semiconductor wafer with a test head providing and receiving test signals through the probes thereby checking the electrical properties of the semiconductor chips sequentially. According to the test method, in order to test a plurality of adjacent semiconductor chips simultaneously, as many probes are provided as the number of semiconductor chips to be tested simultaneously, the test head is capable of providing and receiving test signals for the plurality of semiconductor chips simultaneously, and the number of semiconductor chips that are tested simultaneously is determined without being limited to a power of 2.

REFERENCES:
patent: 3781683 (1973-12-01), Freed
patent: 4899107 (1990-02-01), Corbett et al.
patent: 4967146 (1990-10-01), Morgan et al.
patent: 5070297 (1991-12-01), Kwon et al.

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