Multiplex laser-light source and exposure system

Details Multiplex laser-light source and exposure system Multiplex laser-light source and exposure system

2006-06-27

2006-06-27

Harvey, Minsun Oh (Department: 2828)

Coherent light generators

Particular temperature control

Heat sink

Reexamination Certificate

active

07068690

ABSTRACT:
In a laser-light source: submounts each being made of a material having a thermal expansion coefficient of 3.5 to 6.0×10−6/° C. and having a thickness of 200 to 400 micrometers are separately formed on a heat-dissipation block made of copper or copper alloy; a single-cavity nitride-based semiconductor laser chips are respectively mounted junction-side-down on the corresponding submounts; an optical condenser system collects laser beams emitted from the semiconductor laser chips, and couples the collected laser beams to a multimode optical fiber. A bonding surface of each semiconductor laser chip is bonded to a bonding surface of a corresponding submount through a metalization layer and an Au—Sn eutectic solder layer each of which is divided into areas.

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patent: 6718088 (2004-04-01), Okazaki et al.
patent: 2002/0018499 (2002-02-01), Kuniyasu et al.
Japanese Journal of Applied Physics Part 2 Letters, vol. 37, 1998, pp. L1020-1022.

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