Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Patent
1998-11-16
2000-03-28
Lorin, Francis J.
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
156295, 1563031, 29840, H05K 300
Patent
active
060426853
ABSTRACT:
A multiple wire printed circuit board including printed conductor circuit layers, adhesive layers with wires having insulating coating embedded and fixed therein, insulating layers, and connecting through-holes formed at locations where connections will be made, wherein the conductor circuit layers are insulated from other circuit conductors, and the difference in glass transition point between each adhesive layer and the adjoining insulating layer is within the range of 60.degree. C., remains free of peel and voids despite heat history applied to the board, and is capable of high-density wiring, multiplication of circuit layers and a reduction of the number of the manufacturing steps.
REFERENCES:
patent: 3646572 (1972-02-01), Burr
patent: 3674602 (1972-07-01), Keogh et al.
patent: 3674914 (1972-07-01), Burr
patent: 4097684 (1978-06-01), Burr
patent: 4554405 (1985-11-01), Varker
patent: 4642321 (1987-02-01), Schoenberg et al.
patent: 4855333 (1989-08-01), Rudik et al.
patent: 5225268 (1993-07-01), Shibata et al.
patent: 5304399 (1994-04-01), Shibata et al.
Arike Shigeharu
Shinada Eiichi
Suzuki Takayuki
Tsuru Yoshiyuki
Hitachi Chemical Company Ltd.
Lorin Francis J.
LandOfFree
Multiple wire printed circuit board and process for making the s does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Multiple wire printed circuit board and process for making the s, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Multiple wire printed circuit board and process for making the s will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1322829