Multiple wire photosensitive adhesive for wire embedment

Details Multiple wire photosensitive adhesive for wire embedment Multiple wire photosensitive adhesive for wire embedment

1987-04-06

1989-08-08

Bleutge, John C.

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Compositions to be polymerized by wave energy wherein said...

522 83, 522100, 522103, 428413, 428417, 428418, C08L 6300

Patent

active

048553336

ABSTRACT:
A high density dimensionally stable encapsulated wire circuit board and a method of making such a board is described. A photo-curable adhesive having a unique combination of rheological properties is utilized to bond insulated wires to a substrate. The unique combination of rheological properties of the adhesive used in the encapsulated wire circuit boards of this invention include a specified range of values for the Storage Shear Modulus and specified range of values for the Loss Angle ratio.
A new photo-curable adhesive having these properties and a method of obtaining such an adhesive are also described.

REFERENCES:
patent: 3646572 (1972-02-01), Burr
patent: 3888942 (1975-06-01), Tsen
patent: 3980483 (1976-09-01), Nishikubo et al.
patent: 4169732 (1979-10-01), Shipley
patent: 4180608 (1979-12-01), Del
patent: 4212960 (1980-07-01), Hayashi et al.
patent: 4309473 (1982-01-01), Minamisawa et al.
Modern Plastics Encyclopedia, vol. 44, No. 1A, Sep. 1966, pp. 494-497, 499, 501, 504, 505.

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