Semiconductor device manufacturing: process – Making device or circuit emissive of nonelectrical signal – Packaging or treatment of packaged semiconductor
Patent
1998-05-06
2000-10-24
Elms, Richard
Semiconductor device manufacturing: process
Making device or circuit emissive of nonelectrical signal
Packaging or treatment of packaged semiconductor
372 50, H01L 2100
Patent
active
061366234
ABSTRACT:
This invention relates to a multiple wavelength laser structure, and more particularly, to a multiple wavelength laser array structure fabricated by flip-chip bonding from laser structures on two different substrates. A side by side red/IR laser structure is flip-chip bonded to a blue laser structure to form a red/blue/IR hybrid integrated laser structure.
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patent: 5384797 (1995-01-01), Welch et al.
patent: 5640188 (1997-06-01), Andrews
patent: 5644586 (1997-07-01), Kawano et al.
patent: 5920766 (1999-07-01), Floyd
patent: 5999553 (1999-12-01), Sun
Bringans Ross D.
Dunnrowicz Clarence J.
Hofstetter Daniel
Kneissl Michael A.
Sun Decai
Elms Richard
Propp William
Wilson Christian D.
Xerox Corporation
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