Multiple voltage integrated circuit packaging substrate

Details Multiple voltage integrated circuit packaging substrate Multiple voltage integrated circuit packaging substrate

1983-09-22

1987-03-10

Sikes, William L.

Electricity: power supply or regulation systems

Remote sensing

357 74, 323353, H01L 3902

Patent

active

046494170

ABSTRACT:
A multilayer ceramic integrated circuit packaging substrate provides a plurality of integrated circuit operating voltages at the integrated circuit mounting surface thereof without requiring a separate input/output pin and internal power distribution plane for every integrated circuit operating voltage. The substrate includes a power via for supplying a first integrated circuit operating voltage at the integrated circuit mounting surface, and a plurality of voltage converting means on the integrated circuit mounting surface for stepping down the first operating voltage to all other requisite operating voltages. The voltage converting means may be resistors or operational amplifier voltage dividers.

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Blodgett, Jr., Scientific American, Jul. 1983, vol. 249, No. 1, "Microelectronic Packaging", pp. 86-96.
IBM Journal of Research & Development, vol. 26, No. 3, May 1982, pp. 286-296. Armonk, New York, US; C. W. Ho et al.: "The Thin-Film Module as a High-Performance Semiconductor Package.

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