Multiple transistor clamping device and method

Details Multiple transistor clamping device and method Multiple transistor clamping device and method

1992-01-31

1993-10-05

Picard, Leo P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

174 163, 165185, 361710, 361714, 257718, H05K 720

Patent

active

052510980

ABSTRACT:
A heat sink-hybrid circuit assembly clamping device (100) and method (200) are provided for minimizing hybrid circuit assembly substrate-transistor solder joint stress. The clamping device is positioned and selected to provide a net coefficient of linear expansion (CLE) substantially of a magnitude equal to a net coefficient of the substrate material such that uniform pressure and contact are obtained between the transistors of hybrid circuit assemblies and the heat sink.

REFERENCES:
patent: 4288839 (1981-09-01), Prager et al.
patent: 4739447 (1988-04-01), Lecomte
patent: 4853828 (1989-08-01), Penn
patent: 5031074 (1991-07-01), Ravid

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