Multiple transfer molding die

Plastic article or earthenware shaping or treating: apparatus – Distinct means to feed – support or manipulate preform stock... – Opposed registering coacting female molds

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Details

264272170, 425121, 425544, 425588, 425DIG228, B29C 4502, B29C 4516, B29C 4527

Patent

active

050713345

ABSTRACT:
A multiple transfer molding die for molding a plurality of semiconductor devices includes a plurality of resin paths between a pot and a plurality of cavities. Each resin path includes a first runner portion whose cross sectional area is determined according to the length between the center of the pot and the end of the first runner portion.

REFERENCES:
patent: 3779506 (1973-12-01), Adams
patent: 4111635 (1978-09-01), Reinville
patent: 4252294 (1981-02-01), Lichio
patent: 4451224 (1984-05-01), Harding
patent: 4697784 (1987-10-01), Schmid
patent: 4752199 (1988-06-01), Arai
patent: 4900501 (1990-02-01), Saeki et al.

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