Multiple-tool wire bonder

Details Multiple-tool wire bonder Multiple-tool wire bonder

1996-10-23

1998-11-24

Ryan, Patrick

Metal fusion bonding

With means to juxtapose and bond plural workpieces

Wire lead bonder

228 9, 29428, H01L 2160

Patent

active

058396403

ABSTRACT:
A multiple-tool ball bonder includes a first tool (50, 150) and a second tool (52, 152) mounted on a single head (82, 182) requiring only one vision system (78, 178), one positioning system (68, 168), and one computer system (56, 228). The ball bonder (44, 144) allows for the single head (82, 182) to create interconnections between semiconductor devices (10, 148) and lead frame fingers (12, 148) in a first direction with the first tool (50, 150) and the second tool (52, 152) allows interconnections in a second direction (40) without requiring additional equipment or processing runs.

REFERENCES:
patent: 4142288 (1979-03-01), Flammer et al.
patent: 5474224 (1995-12-01), Nishimaki et al.
patent: 5516023 (1996-05-01), Kono

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