Multiple tile scaleable cooling system for semiconductor compone

Details Multiple tile scaleable cooling system for semiconductor compone Multiple tile scaleable cooling system for semiconductor compone

1998-02-17

1999-07-13

Tolin, Gerald

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

165 804, 257714, H05K 720

Patent

active

059235330

ABSTRACT:
A fluid-cooling system for the edge-cooling of semiconductor tiles that are arranged into rows and columns and are mounted on one or more panels is constructed with a coolant supply and return pipe and individual coolant supply and return lines for each of the panels. Fluid flows in separate fluid-cooling passageways for each of the columns of tiles. The passageways are coupled between the coolant supply line and the coolant return line for the panel. The passageways follow a winding path that provides cooling for a major portion of the periphery of all of the tiles that are in a column and for a minor portion of the periphery of all of said tiles that are in adjacent columns. The remaining edges of the tiles in the outermost columns of tiles of a panel that are not cooled by the outermost passageways are cooled by passageway segments that direct fluid from said fluid-cooling passageways. The tiles have a rectangular shape and may contain multi-chip semiconductor modules. The supply and return lines are preferably coupled to the supply and return pipes by quick disconnect couplers.

REFERENCES:
patent: 4072188 (1978-02-01), Wilson et al.
patent: 4873613 (1989-10-01), Iversen
patent: 5088005 (1992-02-01), Ciaccio
patent: 5144531 (1992-09-01), Go
patent: 5150274 (1992-09-01), Okada
patent: 5210440 (1993-05-01), Long
patent: 5718117 (1998-02-01), McDunn
patent: 5740018 (1998-04-01), Rombut, Jr.
patent: 5812372 (1998-09-01), Gaylon

Affiliated with

Also associated with

Rating

Multiple tile scaleable cooling system for semiconductor compone does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Multiple tile scaleable cooling system for semiconductor compone, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Multiple tile scaleable cooling system for semiconductor compone will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2282218