Multiple substrate circuit package

Electricity: electrical systems and devices – Electrostatic capacitors – Fixed capacitor

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Details

174 52FP, 174 52PE, 361388, 361412, 361421, 339 17M, 339 17LM, H05K 118

Patent

active

045546134

ABSTRACT:
A high power circuit package 2 is disclosed for power conditioning electronic circuits. In one embodiment, a plurality of separate ceramic substrates 3-8 are provided, with a common lead frame stamping 12 bonded to all of the substrates. Means are disclosed for aligning the lead frame, preventing the substrates from sliding together during bonding, and for enabling epoxy encapsulation after bonding. In other embodiments, lead frame structure and jumper posts 65-68 and buses 70, 72 are disclosed for selective interconnection of designated circuit sections. In other embodiments, power terminal extension structure 44 is disclosed.

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