Multiple stage electroless deposition of a metal layer

Details Multiple stage electroless deposition of a metal layer Multiple stage electroless deposition of a metal layer

2007-08-28

2007-08-28

Nhu, David (Department: 2818)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Of specified material other than unalloyed aluminum

C257S043000, C257S632000, C257SE21170, C257SE21304, C257SE21174, C257SE21006

Reexamination Certificate

active

11192761

ABSTRACT:
A multiple stage method of electrolessly depositing a metal layer is presented. This method may have the two main stages of first forming a thin metal layer on a metal surface using an electroless plating solution containing activating agents that are highly reactive reducing agents, and second, forming a bulk metal layer over the thin metal layer by using an electroless plating solution containing mildly reactive reducing agents. Through this two stage method, the use of highly reactive reducing agents that may cause the formation of contaminant particles may be minimized. By minimizing the formation of contaminant particles in the electroless plating solution, the lifetime of the solution may be extended and the current leakage between metal interconnect lines may be reduced.

REFERENCES:
patent: 6696758 (2004-02-01), Dubin et al.
patent: 6881642 (2005-04-01), Basceri et al.
patent: 6885074 (2005-04-01), Durlam et al.
patent: 6977224 (2005-12-01), Dubin et al.
patent: 7049234 (2006-05-01), Cheng et al.

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