Patent
1988-01-15
1989-12-19
Hille, Rolf
357 79, H01L 2334, H01L 2340
Patent
active
048886378
ABSTRACT:
A heat sink assembly to dissipate heat from electrical components to ambient surroundings is disclosed. The heat sink assembly of the present invention includes a housing having a mechanism for retaining electrical components within the housing. The electrical components include heat sink tabs. A mechanism is coupled with the housing and the heat sink tabs of the electrical components to dissipate heat from the electrical components to the ambient surroundings. Also, a mechanism is associated with the assembly to couple the assembly to a circuit board or the like.
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IBM Technical Disclosure Bulletin, vol. 24, No. 7B, Dec. 1981.
Mangliers Thomas J.
Merchant Daniel P.
Sway-Tin Min
Calcaterra Mark P.
Chrysler Motors Corporation
Clark S. V.
Hille Rolf
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