Multiple semiconductor containing package having a heat sink cor

Details Multiple semiconductor containing package having a heat sink cor Multiple semiconductor containing package having a heat sink cor

1984-07-23

1985-12-31

Tolin, G. P.

Electricity: electrical systems and devices

Electrostatic capacitors

Fixed capacitor

357 81, 165 76, 165 804, H05K 720

Patent

active

045625123

ABSTRACT:
A semiconductor package includes a cubicle heat sink core. A pair of heat sink caps, each having a concave surface defined by three mutually perpendicular faces are provided. The caps substantially encapsulate the core while being spaced therefrom with each of the faces being generally parallel to a corresponding side of the core. Semiconductors are sandwiched between each side of the core and the associated parallel face and springs bias the cap towards each other and towards the core to provide the requisite thermal and electrical contact pressure.

REFERENCES:
patent: 2815472 (1957-12-01), Jackson
patent: 2950093 (1960-08-01), Krempel et al.
patent: 3226466 (1965-12-01), Martin
patent: 3364987 (1968-01-01), Bylurd
patent: 3389305 (1968-06-01), Bond
patent: 3586917 (1971-06-01), Oates
patent: 3727114 (1973-04-01), Oshima
patent: 4010489 (1977-03-01), Bourbeau

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