1990-07-18
1991-10-22
James, Andrew J.
357 80, 357 67, H01L 2354, H01L 2314
Patent
active
050600494
ABSTRACT:
A ceramic multilayer wiring substrate is provided on which the metallized wirings are partially altered to provide multiple resistivities without changing the other electrical properties associated with a particular physical wiring geometry. Sequentially positioning conductive materials of different resistivities along the length of each individual wiring produces a final wiring pattern where each individual wiring can have a different resistance from the other wirings. A multiple resistivity wiring pattern can maximize the operation of a semiconductor chip attached thereto, for example, by reducing the effect of electronic noise on the semiconductor.
REFERENCES:
patent: 3927815 (1975-12-01), Mase et al.
Bhattacharyya Bidyut
Hirano Mitsuru
Kato Naomiki
Mouri Kouichi
Schmitt Michael A.
Clark S. V.
Intel Corporation
James Andrew J.
NGK Spark Plug Co. Ltd.
NGK Spark Plugs (U.S.A.), Inc.
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