Multiple pulse space processing to enhance via entrance formatio

Details Multiple pulse space processing to enhance via entrance formatio Multiple pulse space processing to enhance via entrance formatio

1996-11-08

1998-11-24

Mills, Gregory L.

Electric heating

Metal heating

By arc

21912161, 21912185, 216 17, 427554, B23K 2600

Patent

active

058411020

ABSTRACT:
A method for forming a through-via in a laminated substrate by laser drilling a through-via from a top exposed surface of the substrate to a bottom exposed surface of the substrate using a plurality of laser pulses that are spaced at the first pulse spacing. Each pulse spaced at the first pulse spacing has a first energy density per pulse. Then, the through-via is laser drilled using a plurality of laser pulses that are trepanned at a second pulse spacing. Each pulse spaced at the second pulse spacing has a second energy density per pulse. The second energy density per pulse is greater than the first energy density per pulse, and the second pulse spacing is less than the first pulse spacing.

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