Electricity: electrical systems and devices – Electrostatic capacitors – Fixed capacitor
Patent
1988-12-07
1990-03-27
Tolin, Gerald P.
Electricity: electrical systems and devices
Electrostatic capacitors
Fixed capacitor
361396, 361413, 165185, 439487, H05K 720
Patent
active
049126016
DESCRIPTION:
BRIEF SUMMARY
BACKGROUND OF THE INVENTION
The invention relates to a multiple-plate hybrid device with integrated heat dissipation. An integrated hybrid circuit designates a microcircuit in which passive components such as resistors, capacitors and small inductances, including their interconnections, are produced as a film circuit. Active components and possibly also simple integrated circuits are then used in this partial circuit as semiconductor components. While the modular type construction of devices has already been in use for a long time, it has found little use in hybrid technology. Generation of heat during the operation of hybrid substrates and its elimination may be the most substantial obstacle. This is particularly true when arranging a plurality of hybrid substrates in a compact space.
SUMMARY OF THE INVENTION
The object of the invention is to provide a multiple-plate hybrid device with integrated favorable heat dissipation. According to the invention, this object is achieved by inserting thick-film hybrid substrates in metal frames of a metal housing and by coupling the hybrid substrates at least partially with the portions of the metal frames. The hybrid device of the invention has the advantage that a plurality of layers of hybrid substrates, particularly thick-film hybrid substrates, can be used which have a favorable thermal dissipation, a very high density of components and thus a modular construction assembly occurs with almost unlimited possibilities of expansion.
Metal frames with and without heat dissipation can be considered as metal frames for holding the thick-film hybrid substrates. The metal frames with heat dissipation should comprise a metal plate for contacting the thick-film hybrid substrate and should overlap the thick-film hybrid substrates with side legs while forming guide grooves. The heat dissipation is improved when the thick-film hybrid substrates are glued on the metal plates.
However, it can also be necessary, depending on requirements, to arrange metal frames for substrates which should not come into contact with metallic enveloping surfaces. Such intermediate carriers consist of frames which are located opposite one another, guide grooves being formed in the end faces of the latter, which face one another, for insertion of thick-film hybrid substrates.
It is possible in this way to produce a desired module and reduce and expand it with the modular construction principle. The number of desired metal frames with inserted thick-film hybrid substrates are then screwed together. In this way, a compact metal housing is formed with a very favorable capability for a thermal coupling.
The back of this metal housing is covered by a cover which engages a correspondingly arranged sealing groove on the back of the metal housing with an annular projection.
Another important feature of the invention is the solution of the problem of the interconnection between the thick-film hybrid substrates, which are arranged in the metal housing and outside of the housing. For this purpose, the connection lugs projecting from the thick-film hybrid substrates are to be brought together by a connection board or punched grid. This connection board is covered with a masking section on the front of the metal housing, wherein a plug penetrates this masking section and engages in the connection board with contact plug pins. The contact pins end e.g. in contact holes of the plug, wherein these contact holes are accessible from the outside. Accordingly, a suitable connection is produced between the hybrid circuit and the outside of the housing.
The connection board or punched grid, for example, a printed circuit board, can be rigid or flexible.
The invention as to its construction so to its mode of operation, together with additional objects and advantages thereof, will be best understood from the following description with reference to the appended drawings.
BRIEF DESCRIPTION OF THE DRAWINGS
FIG. 1 shows a partial longitudinal sectional view of a multiple-plate hybrid device according to the invention.
F
REFERENCES:
patent: 3963301 (1976-06-01), Stark
patent: 4179172 (1979-12-01), Godsey
patent: 4203147 (1980-05-01), Gabr
patent: 4225900 (1980-09-01), Ciccio
patent: 4339628 (1982-07-01), Marcantonio
patent: 4549200 (1985-10-01), Ecker
patent: 4597291 (1986-07-01), Motomiya
Robert & Bosch GmbH
Striker Michael J.
Tolin Gerald P.
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