Multiple-plane pair thin-film structure and process of manufactu

Semiconductor device manufacturing: process – With measuring or testing – Packaging or treatment of packaged semiconductor

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Details

438109, 438624, 257686, 257700, 257759, H01L 2302, H01L 2312, H01L 23053, H01L 2940, G01R 2166

Patent

active

060906332

ABSTRACT:
A multiple plane pair thin-film structure and a process for the manufacture of that structure. The multiple plane pair thin-film structure is of modular design and manufacture, such that each module comprising the structure is manufactured and tested individually before assembly. The thin film wiring structure is comprised of a plurality of true plane pair thin-film structures. Each such plane pair thin-film structure is manufactured as a module, the functionality of which can be tested for conformity to applicable specifications. Each module is designed and fabricated as a plane pair thin-film structure.

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