Multiple path signal distribution to large scale integration chi

Details Multiple path signal distribution to large scale integration chi Multiple path signal distribution to large scale integration chi

1983-09-27

1986-12-23

Sikes, William L.

357 75, 357 80, H01L 2302, H01L 2316, H01L 3902

Patent

active

046315721

ABSTRACT:
An integrated circuit package has a conductive ring surrounding the integrated circuit substrate and optionally, over the integrated circuit itself, and wires connected between selected chip pads and adjacent portions of the surrounding ring, the surrounding ring being connected to only one of a plurality of external conductive pins of the chip package, the remainder of the external pins being connected to other selected chip pads.

REFERENCES:
patent: 3872583 (1975-03-01), Beall et al.
patent: 3908185 (1975-09-01), Martin
patent: 4067040 (1978-01-01), Tsuzuki et al.
patent: 4255672 (1981-03-01), Ohno et al.
patent: 4531145 (1985-07-01), Wiech, Jr.

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