Multiple pass method of applying printing paste upon a substrate

Details Multiple pass method of applying printing paste upon a substrate Multiple pass method of applying printing paste upon a substrate

1975-12-03

1977-05-24

Smith, Ronald H.

Coating processes

Heat decomposition of applied coating or base material

427123, 427126, 427229, 427265, 427266, 427376A, 427376B, 427376C, 427376H, 427380, 427376E, 427376G, B05D 302, B05D 512

Patent

active

040256693

ABSTRACT:
Multiple pass method of applying printing paste upon a substrate wherein the method includes the application upon a substrate of a printing paste composition containing an inorganic particulate material, a pyrolyzable organic binder and a solvent system for the organic binder which comprises a low boiling temperature solvent and a high boiling temperature solvent. The method includes the steps of applying a first layer of the printing paste composition and the thermal removal of substantially all of the low boiling temperature solvent, but not the high boiling temperature solvent or binder, prior to superimposing the next pass or layer of printing paste having the same characteristics as the first layer thereover. Following the application of the desired number of layers and removal of low boiling temperature solvent in this manner, the high boiling temperature solvent and the binder are thermally removed and the inorganic particulate material is fused to the substrate.

REFERENCES:
patent: 3331801 (1967-07-01), Osmond et al.
patent: 3625733 (1971-12-01), Mansur
patent: 3661615 (1972-05-01), Gray et al.
patent: 3779807 (1973-12-01), Taylor et al.

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