Multiple parallel impingement flow cooling with tuning

Details Multiple parallel impingement flow cooling with tuning Multiple parallel impingement flow cooling with tuning

1995-06-30

1997-02-18

Tolin, Gerald P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

165908, 257722, 277226, 361719, H05K 720

Patent

active

056046650

ABSTRACT:
An integrated coolant fluid supply and exhaust distribution pathdefining structure is employed to provide a substantially planar cooling system for an electronic assembly which includes a substrate having electronic modules or electronic chips disposed thereon. The pathdefining structure includes interleaved supply and exhaust channels with the supply channels including apertures disposed adjacent to heat sink shafts which are connected to planar heat sink structures in thermal contact with chips or modules being cooled. The pathdefining structure produces a fluid flow path which is initially aligned with the surface area enhancing heat sink shafts and which exits therefrom in a plurality of directions which ultimately lead to the exhaust channels provided in the path-defining structure. The assembly, which includes an exterior housing and the substrate, provides a compact cooling mechanism for electronic components. The cooling structure is both compact and permits high density placement of electronic chips or modules. The system is particularly adaptable in that it permits fine tuning of fluid flow to various ones of the chips or modules and stacking of the assemblies themselves.

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