Multiple microelectromechanical (MEM) devices formed on a...

Measuring and testing – Speed – velocity – or acceleration – Angular rate using gyroscopic or coriolis effect

Reexamination Certificate

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C438S106000, C438S108000

Reexamination Certificate

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11031029

ABSTRACT:
Methods and apparatus are provided forming a plurality of semiconductor devices on a single substrate, and sealing two or more of the devices at different pressures. First and second semiconductor devices, each having a cavity formed therein, are formed on the same substrate. The cavity in the first device is sealed at a first pressure, and the cavity in the second device is sealed at a second pressure.

REFERENCES:
patent: 6287893 (2001-09-01), Elenius et al.
patent: 6470594 (2002-10-01), Boroson et al.
patent: 6516665 (2003-02-01), Varadan et al.
patent: 6770506 (2004-08-01), Gogoi
Candler et al., “Single Wafer Encapsulation of MEMS Devices,” IEEE Transactions on Advanced Packaging, vol. 26, No. 3, Aug. 2003, pp. 227-232.
Gogoi et al., “A Low-Voltage Force-Balanced Pressure Sensor with Hermetically Sealed Servomechanism,” IEEE, 1999, pp. 493-498.
Lin et al., “Microelectromechanical Filters for Signal Processing,” Journal of Microelectromechanical Systems, vol. 7, No. 3, Sep. 1998, pp. 286-294.

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