Multiple line grids incorporating therein circuit elements

Details Multiple line grids incorporating therein circuit elements Multiple line grids incorporating therein circuit elements

1999-11-30

2001-11-20

Williams, Alexander O. (Department: 2811)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

C257S737000, C257S738000, C257S772000, C257S778000, C257S668000, C257S686000, C257S685000, C257S774000, C257S758000, C257S700000, C257S780000, C361S782000, C361S766000, C361S734000, C361S301100, C361S735000, C361S729000, C174S250000, C174S252000, C174S260000, C174S261000

Reexamination Certificate

active

06320249

ABSTRACT:

FIELD OF THE INVENTION
The present invention relates to an integrated circuit(IC) packaging; and, more particularly, to a multiple line grid array(MLGA) package including therein multiple line grids(MLGs), the MLGs incorporating therein circuit elements such as metal lines, resistors, inductors, capacitors, transistors or combinations thereof.
DESCRIPTION OF THE PRIOR ART
One of the most noticeable design trend in electronics industry nowadays is toward miniaturization through integration and densification of the circuit elements, and one of the technologies being developed to achieve this end is surface mount technology(SMT) which is being employed as a cost-effective means of mounting IC devices to printed circuit boards(PCBs). Numerous different techniques for mounting integrated circuit devices to circuit boards, chip carriers, or other components fall within the general category of SMT. Of these techniques, area array(as opposed to perimeter array) technology is often used to mount high I/O density packages with a great degree of reliability and manufacturing efficiency. Area array techniques include the use of pin grid array(PGAs), column grid arrays(CGAs), and ball grid arrays (BGAs). The more recent BGA and CGA techniques provide substantial improvements over PGA methods in that higher densities, reliability, and efficiency can be obtained for many types of packages.
As the name implies, ball grid arrays(BGAs) utilize a grid or array of electrical terminals, such as solder balls arranged on one side of the IC package to effectuate electrical contact with the circuit board The solder balls of the array may vary in material, size(height and width) and pitch(i.e., ball-to-ball spacing) according to the individual package. Additionally, the solder balls may be arranged in a uniform or a non-uniform array pattern, with some leads removed in certain areas, which is referred to as “depopulation”, depending on the desired attributes of the package. Solder balls are typically attached to the board or module using lead/tin eutectic solder balls, thereby allowing removal and rework without damage to the components
There is shown in
FIG. 1
a typical prior art surface mount of a flip-chip type BGA package
200
on a printed circuit board
202
, showing the solder joints
203
formed between the balls
311
of the BGA and the lands
220
on PCB
202
Although the above described BGA packaging has become one of the most popular packaging alternatives for a semiconductor device with high I/O terminals in the art, however, the conventional BGA packaging is saddled with a number of problems, one of them being, that as the I/O density increases, the number of the solder balls required increases, resulting in requiring the size of the solder balls and the standoff height thereof to be reduced accordingly, the former resulting in making the proper alignment difficult and the latter, resulting in making it difficult for the heat generated by the chip to be efficiently extracted. To alleviate the above stated problems of the BGA packaging, a multiple line grid array(MLGA) package has been introduced, which is disclosed in a copending commonly owned application, U.S. Ser. No. 09/203,196, entitled “Multiple Line Grid Array Package” and incorporated herein as a reference.
However, in spite of the recent developments in SMT, the miniaturization effort is still hindered by the presence of circuit elements such as resistors, capacitors, inductors, transistors or combinations thereof which are usually mounted on the PCB along with IC devices. In other word, if means for reducing the number of circuit elements present on the PCB can somehow be found, then it will make a further miniaturization possible.
With a view to reducing the number of circuit elements present on the PCB, there has been suggested to embed the circuit elements into the package substrate in case of the BGA packaging. However, in the case of a flip-chip type BGA packaging without a package substrate, the problem described hereinabove still remains to be solved.
SUMMARY OF THE INVENTION
It is, therefore, a primary object of the present invention to provide a multiple line grid array(MLGA) package including multiple line grids (MLGs), the MLGs incorporating therein circuit elements, e.g., metal lines, resistors, capacitors, inductors, transistors or a combination thereof.
In accordance with one aspect of the present invention, there is provided a multiple line grid array package comprising: a semifinished package including a surface, wherein a first metal pattern is formed on the surface for connecting a number of input/output terminals; a printed circuit board including a top surface, wherein a second metal pattern is formed on the top surface according to the first metal pattern; and at least of a multiple line grid, disposed between the semifinished package and the printed circuit board, including a non-conductive body incorporated therein a plurality of circuit elements and multiple number of conductors in the form of a column, each of the conductors being electrically isolated from each other and being electrically connected to the circuit elements, the first and the second metal patterns.


REFERENCES:
patent: 4803595 (1989-02-01), Kraus et al.
patent: 5177594 (1993-01-01), Chance et al.
patent: 5629838 (1997-05-01), Knight et al.
patent: 5977640 (1999-11-01), Bertin et al.

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