Multiple level mask for patterning of ceramic materials

Etching a substrate: processes – Forming or treating electrical conductor article – Forming or treating of groove or through hole

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

216 47, 216 66, 430316, 430317, 430320, 430312, 437 3, 437180, 1566431, 1566441, 1566511, 15666111, B44C 122, C03C 1500

Patent

active

055870902

ABSTRACT:
A novel multiple level mask (e.g. tri-level mask 36) process for masking achieves a desired thick mask with substantially vertical walls and thus improves the ion milling process of ceramic materials (e.g. BST). An embodiment of the present invention is a microelectronic structure comprising a ceramic substrate, an ion mill mask layer (e.g. photoresist 42) overlaying the substrate, a dry-etch-selective mask layer (e.g. TiW 40) overlaying the ion mill mask layer, the dry-etch-selective mask layer comprising a different material than the ion mill mask layer, a top photosensitive layer (38) overlaying the dry-etch-selective mask layer, the top photosensitive layer comprising a different material than the dry-etch-selective mask layer, and a predetermined pattern formed in the top photosensitive layer, the dry-etch-selective mask layer and the ion mill mask layer. The predetermined pattern has substantially vertical walls in the ion mill mask layer.

REFERENCES:
patent: 4080532 (1978-03-01), Hopper
patent: 4377437 (1983-03-01), Taylor et al.
patent: 4437969 (1984-03-01), Covington et al.
patent: 4589952 (1986-05-01), Behringer et al.
patent: 4745042 (1988-05-01), Sasago et al.
patent: 4745278 (1988-05-01), Hanson
patent: 4792681 (1988-12-01), Hanson
patent: 4808682 (1989-02-01), Schwalm et al.
patent: 4815199 (1989-03-01), Jenner et al.
patent: 4838991 (1989-06-01), Cote et al.
patent: 4927711 (1990-05-01), Ferrett
patent: 5126231 (1992-06-01), Levy
patent: 5134090 (1992-07-01), Bean et al.
patent: 5292402 (1994-03-01), Abt et al.
patent: 5314772 (1994-05-01), Kozicki et al.
patent: 5426304 (1995-06-01), Belcher et al.
Elliott, David J.; "Integrated Circuit Fabrication Technology" .COPYRGT. 1982 pp. 363-367.
Thompson et al; "Introduction to Microlithography" .COPYRGT.1983 pp. 311-318 (ACS Series 219).
D. J. Warner, D. J. Pedder, J. S. Moody, and J. Burrage, "The Preparation and Performance of Reticulated Targets for the Pyroelectric Vidicon,"Ferroelectrics, 33, 1981, pp. 249-253.
R. Watton, F. Ainger, S. Porter, D. Pedder and J. Gooding, "Technologies and Performance for Linear and Two Dimensional Pyroelectric Arrays", SPIE vol. 510, Infrared Technology X, 1984, pp. 139-149.
T. D. Flaim, G. A. Barner, and T. Brewer, "A Novel Release Layer syster for IC Processing", Brewer Science, Inc. Rolla, Missouri, presented at KTI IF Conference, Nov. 1989.
C. Hanson, H. Beratan, R. Owen, and K. Sweetser, "Low-Cost Uncooled Focal Plane Array Technology", Texas Instruments Incorporated, DSEG, presented at IRIS Specialty Group on Infrared Detectors, Bedford, MA, Jul. 14, 1993.
C. Hanson "Uncooled Thermal Imaging at Texas Instruments,", SPIE 1993, Inernational Symposium on Optics, Imaging and Instrumentation, Infrared Technology XIX, San Diego, Jul. 14, 1993.
H. Kaufman, R. Robinson, W. Hughes, "Characteristics, Capabilities, and Applications Broad-Beam Sources", Commonwealth Scientific Corporation, Alexandria, Virginia, 1987.
R. Watton, "Ferroelectrics for Infrared Detection and Imaging" ISAF '86, Proceedings of the Sixth IEEE International Symposium on Applications of Ferroelectrics, Jun., 1986.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Multiple level mask for patterning of ceramic materials does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Multiple level mask for patterning of ceramic materials, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Multiple level mask for patterning of ceramic materials will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1176701

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.