Multiple lead probe for integrated circuits in wafer form

Details Multiple lead probe for integrated circuits in wafer form Multiple lead probe for integrated circuits in wafer form

1987-06-09

1990-03-27

Eisenzopf, Reinhard J.

Electricity: measuring and testing

Measuring, testing, or sensing electricity, per se

With rotor

324158F, 324 725, G01R 102, G01R 104

Patent

active

049123998

ABSTRACT:
A probe assembly for use in conveying signals between cables from test apparatus and contact areas on a contact face of an integrated circuit includes a support member having an aperture therein and a dielectric membrane clamped over the aperture such that conductive bumps mounted on the underside of the periphery of the membrane engage corresponding contact areas on an upper surface of the support member surrounding the aperture. A central area of the membrane extends downward through the aperture such that conductive bumps on the under side of the central area of the membrane engage contact areas on the contact face of an integrated circuit situated below the aperture. A plurality of conductor runs supported by the membrane extend from the conductive bumps in the central area of the membrane to the conductive bumps in the periphery of the membrane. A plurality of second conductor runs supported by the support member extend from the contact areas surrounding the aperture to test apparatus cable connectors adjacent to the periphery of the support member.

REFERENCES:
patent: 3596228 (1971-07-01), Reed et al.
patent: 4567433 (1986-01-01), Ohkubo et al.
patent: 4574235 (1986-03-01), Kelly et al.
patent: 4636722 (1987-01-01), Ardezzone
patent: 4649339 (1987-03-01), Grangroth et al.
patent: 4733172 (1988-03-01), Smolley

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