Multiple-lead element soldering method using sheet solder

Details Multiple-lead element soldering method using sheet solder Multiple-lead element soldering method using sheet solder

1993-02-24

1993-12-21

Heinrich, Samuel M

Metal fusion bonding

Process

Plural joints

228223, 228249, 228102, H05K 334

Patent

active

052715493

ABSTRACT:
A multiple-lead element soldering method of this invention contains a step of beforehand mounting a band-shaped sheet solder on a wiring board so as to be bridged over land portions of a wiring pattern on which lead terminals of the multiple-lead element are to be soldered, and a step of heating the band-shaped sheet solder by a heat press method to melt the band-shaped sheet solder, whereby the land portions of the wiring pattern and the lead terminals of the multiple-lead element are accurately soldered through the melted band-shaped sheet solder with sufficient amount of solder.

REFERENCES:
patent: 3574923 (1971-04-01), Cushman
patent: 5180097 (1993-01-01), Zenshi
IBM Technical Disclosure Bulletin, "Contact Solder Reflow Frame", vol. 30, No. 3, Aug. 1987.

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