Multiple layer printed circuit boards and method of manufacture

Details Multiple layer printed circuit boards and method of manufacture Multiple layer printed circuit boards and method of manufacture

1993-08-23

1994-11-08

Ryan, Patrick J.

Stock material or miscellaneous articles

Layer or component removable to expose adhesive

Halogen containing compound

428209, 428414, 428416, 428901, 156315, 174259, B32B 900

Patent

active

053625340

ABSTRACT:
A printed circuit board and method of manufacture thereof is disclosed. The printed circuit board includes a first substrate provided from a conductive layer having disposed on a first surface thereof a cured adhesive layer. A semi-cured adhesive layer is then disposed over the cured adhesive layer and a second substrate is disposed against the semi-cured adhesive layer.

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