Multiple layer printed circuit board

Details Multiple layer printed circuit board Multiple layer printed circuit board

1993-06-24

1994-12-27

Picard, Leo P.

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

174 35R, 174266, 174250, 361816, 361794, H05K 102

Patent

active

053767594

ABSTRACT:
A multiple layer printed circuit board and a method of manufacturing multiple layer printed circuit boards which incorporate integral edge shielding in combination with top and bottom shielding to effectively provide a sandwich arrangement within a Faraday Cage. Electromagnetic emissions radiating from an outside surface of either the top or bottom shielding layer are substantially reduced. In one structure, a multiple layer printed circuit board having a sandwich arrangement which includes at least one inner conductive layer for providing a ground plane disposed between the outer shielding layers, the inner conductive layer being electrically connected directly to the edge shield and hence to the outer conductive layers. The larger and more continuous surface area provided by the direct connection to the edge shielding effectively provides an electrical connection having a low inductance and hence in operation results in all ground planes having a more constant non-varying potential.

REFERENCES:
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patent: 4849284 (1989-07-01), Arthur et al.
patent: 5003273 (1991-03-01), Oppenberg
patent: 5067232 (1991-11-01), Seidel et al.
patent: 5160907 (1992-11-01), Nakajima et al.
patent: 5206986 (1993-05-01), Arai et al.

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