Multiple-layer, multiple-phase titanium/nitrogen adhesion/diffus

Details Multiple-layer, multiple-phase titanium/nitrogen adhesion/diffus Multiple-layer, multiple-phase titanium/nitrogen adhesion/diffus

1986-06-16

1987-10-27

Rutledge, L. Dewayne

Stock material or miscellaneous articles

All metal or with adjacent metals

Composite; i.e., plural, adjacent, spatially distinct metal...

428627, 428660, 428673, 357 71, 20419217, 437246, B32B 1504, H01L 2354

Patent

active

047029676

ABSTRACT:
To securely attach a narrow line width electrodeposited layer of gold to an underlying semiconductor structure a thin multiphase adhesion film of nitrogen-modified titanium is formed between a titanium nitride diffusion barrier layer and an overlying gold seed layer. This additional layer nitrogen-modified titanium layer provides a titanium base to ensure adhesion of the gold, yet contains sufficient nitrogen interstitially dispersed in the thin titanium film to prevent formation of unetchable gold-titanium compounds.

REFERENCES:
patent: 3106489 (1963-10-01), Lepselter
patent: 3287612 (1966-11-01), Lepselter
patent: 3879746 (1975-04-01), Fournier
patent: 4226932 (1980-10-01), Ferraris

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