Multiple layer microwave integrated circuit module connector ass

Details Multiple layer microwave integrated circuit module connector ass Multiple layer microwave integrated circuit module connector ass

1992-12-03

1994-11-08

Gensler, Paul

Wave transmission lines and networks

Long line elements and components

Strip type

257728, 333260, 361730, 439 63, 439 81, H01P 500, H05K 500

Patent

active

053630750

ABSTRACT:
A connector assembly for interconnecting microwave integrated circuit modules where each module has at least one microwave interconnection pin and one DC power pin. A groundplane (28) supports the mounting surfaces (32) of the modules (10) and has a plurality of holes (38, 40) for receiving the interconnection pins (18) and the DC power pins (22) of the modules. A conducting layer (78) opposite the mounting surface of the groundplane receives microwave signals from the interconnection pins extending down through it and communicates these signals between different modules. Resilient bellows and stripline are used to ensure matched impedances and secure microwave connections. The DC power pins extend through the conducting layer (78) and isolating groundplane (28) and a DC power grid board (88) where an electrical connection is made with each DC power pin. The DC power pins are held in place in the power grid board using spring sockets so that the modules are installed on the connector assembly simply by inserting the pins into the respective holes and removed simply by pulling the modules away from the connector assembly.

REFERENCES:
patent: 4577923 (1986-03-01), Ikemizu
patent: 4745381 (1988-05-01), Kosugi et al.
patent: 5049978 (1991-09-01), Bates et al.
patent: 5206712 (1993-04-01), Kornrumpf et al.

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