Multiple-layer microstrip assembly with inter-layer connections

Details Multiple-layer microstrip assembly with inter-layer connections Multiple-layer microstrip assembly with inter-layer connections

1992-10-28

1994-05-03

Gensler, Paul

Wave transmission lines and networks

Plural channel systems

Having branched circuits

29830, 333 24C, 333246, H01P 518, H01P 318

Patent

active

053091221

ABSTRACT:
A multiple-layer microstrip assembly having an inter-layer connection for transitioning electrical signals between analogous surfaces of separate layers, comprising a plurality of layers, each having a top surface and a bottom surface; first top circuitry disposed on the first top surface of a first layer; first bottom circuitry disposed on the first bottom surface of the first layer; connecting means for electrically connecting the first top circuitry to the first bottom circuitry; second top circuitry disposed on the second top surface of a second layer; and binding means to hold the two layers together, wherein the first bottom circuitry is sufficiently adjacent and overlapping the second top circuitry to form an electrical connection therebetween, thereby forming a signal transition between the first top surface of the first layer and the second top surface of the second layer.

REFERENCES:
patent: 2754484 (1956-07-01), Adams
patent: 3303439 (1967-02-01), Fulp
patent: 3345589 (1967-10-01), Di Piazza
patent: 3883828 (1975-05-01), Cappucci
patent: 4375053 (1983-02-01), Viola et al.
patent: 4459568 (1984-07-01), Landt
patent: 4761654 (1988-08-01), Zaghloul
patent: 4803450 (1989-02-01), Burgess et al.
patent: 4810981 (1989-03-01), Herstein
patent: 4906953 (1990-03-01), Li et al.
patent: 4980659 (1990-12-01), Allard
patent: 5031308 (1991-07-01), Yamashita et al.
patent: 5261153 (1993-11-01), Lucas

Affiliated with

Also associated with

Rating

Multiple-layer microstrip assembly with inter-layer connections does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Multiple-layer microstrip assembly with inter-layer connections, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Multiple-layer microstrip assembly with inter-layer connections will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2117689