Multiple layer deposition for improving adhesion

Details Multiple layer deposition for improving adhesion Multiple layer deposition for improving adhesion

2005-08-30

2009-08-25

Vo, Hai (Department: 1794)

Stock material or miscellaneous articles

Web or sheet containing structurally defined element or...

Composite having voids in a component

C428S319100, C428S319300, C428S319700, C428S901000

Reexamination Certificate

active

07579070

ABSTRACT:
Methods to improve adhesion of a first material to a second material and electronics devices fabricated using such methods are described. A porous polymer layer is formed on a conductive layer. Forming the porous polymer layer leaves portions of the conductive layer exposed. A porous conductive layer is formed over the porous polymer layer and the exposed portions of the conductive layer. A continuous polymer layer is formed over the porous conductive layer. In one embodiment, the polymer layer includes a ferroelectric polymer, and the conductive layer includes a noble metal, e.g., gold.

REFERENCES:
patent: 4524374 (1985-06-01), Denda et al.
patent: 5381125 (1995-01-01), Chen et al.
patent: 5618737 (1997-04-01), Robin et al.
patent: 6699728 (2004-03-01), Guenther et al.
patent: 6819540 (2004-11-01), Allen et al.
patent: 2003/0104249 (2003-06-01), Okuno et al.
patent: 2007/0003737 (2007-01-01), Khalaf et al.

Affiliated with

Also associated with

Rating

Multiple layer deposition for improving adhesion does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Multiple layer deposition for improving adhesion, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Multiple layer deposition for improving adhesion will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4099594