Multiple lamination high density interconnect process and struct

Details Multiple lamination high density interconnect process and struct Multiple lamination high density interconnect process and struct

1990-07-02

1992-11-03

Picard, Leo P.

Electricity: electrical systems and devices

Miscellaneous

H05K 111

Patent

active

051610930

ABSTRACT:
A high density interconnect structure incorporating a plurality of laminated dielectric layers is fabricated using a SPI/epoxy crosslinking copolymer blend adhesive in order to maintain the stability of the already fabricated structure during the addition of the later laminations while also maintaining the repairability of the high density interconnect structure.

REFERENCES:
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patent: 4884122 (1989-11-01), Eichelberger et al.
patent: 5073814 (1991-12-01), Cole, Jr. et al.
patent: 5108825 (1992-04-01), Wojnarowski et al.

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