Active solid-state devices (e.g. – transistors – solid-state diode – With shielding
Reexamination Certificate
2007-10-23
2007-10-23
Ahmed, Shamim (Department: 1765)
Active solid-state devices (e.g., transistors, solid-state diode
With shielding
C257S660000, C438S455000, C438S456000, C216S002000
Reexamination Certificate
active
10865344
ABSTRACT:
A Multiple Internal Seal Ring (MISR) Micro-Electro-Mechanical System (MEMS) vacuum package that hermetically seals MEMS devices using MISR. The method bonds a capping plate having metal seal rings to a base plate having metal seal rings by wafer bonding the capping plate wafer to the base plate wafer. Bulk electrodes may be used to provide conductive paths between the seal rings on the base plate and the capping plate. All seals are made using only metal-to-metal seal rings deposited on the polished surfaces of the base plate and capping plate wafers. However, multiple electrical feed-through metal traces are provided by fabricating via holes through the capping plate for electrical connection from the outside of the package through the via-holes to the inside of the package. Each metal seal ring serves the dual purposes of hermetic sealing and providing the electrical feed-through metal trace.
REFERENCES:
patent: 392650 (1888-11-01), Watrous
patent: 4898031 (1990-02-01), Oikawa et al.
patent: 5203208 (1993-04-01), Bernstein
patent: 5226321 (1993-07-01), Varnham et al.
patent: 5421312 (1995-06-01), Dawson
patent: 5507080 (1996-04-01), Hayashi et al.
patent: 5578976 (1996-11-01), Yao et al.
patent: 5646346 (1997-07-01), Okada
patent: 5665915 (1997-09-01), Kobayashi et al.
patent: 5728936 (1998-03-01), Lutz
patent: 5783749 (1998-07-01), Lee et al.
patent: 5894090 (1999-04-01), Tang et al.
patent: 5905202 (1999-05-01), Kubena et al.
patent: 5920012 (1999-07-01), Pinson
patent: 5987985 (1999-11-01), Okada
patent: 6009751 (2000-01-01), Ljung
patent: 6044705 (2000-04-01), Neukermans et al.
patent: 6145380 (2000-11-01), Macgugan et al.
patent: 6151964 (2000-11-01), Nakajima
patent: 6164134 (2000-12-01), Cargille
patent: 6182352 (2001-02-01), Deschenes et al.
patent: 6257057 (2001-07-01), Hulsing, II
patent: 6263552 (2001-07-01), Takeuchi et al.
patent: 6282958 (2001-09-01), Fell et al.
patent: 6289733 (2001-09-01), Challoner et al.
patent: 6628177 (2001-12-01), Goudal
patent: 6367786 (2002-04-01), Gutierrez et al.
patent: 6479320 (2002-11-01), Gooch
patent: 6481284 (2002-11-01), Geen et al.
patent: 6481285 (2002-11-01), Shkel et al.
patent: 6515278 (2003-02-01), Wine et al.
patent: 6629460 (2003-10-01), Challoner
patent: 6856217 (2005-02-01), Clark et al.
patent: 6985051 (2006-01-01), Nguyen et al.
patent: 2002/0066317 (2002-06-01), Lin
patent: 2003/0010123 (2003-01-01), Malvern et al.
patent: 2003/0029238 (2003-02-01), Challoner
patent: 2004/0055380 (2004-03-01), Shcheglov et al.
patent: 44 42 033 (1996-05-01), None
patent: 19719601 (1998-11-01), None
patent: 0 461 761 (1991-12-01), None
patent: 0461761 (1991-12-01), None
patent: 0971208 (2000-01-01), None
patent: 1055908 (2000-11-01), None
patent: 0 971 208 (2000-12-01), None
patent: 01129517 (1989-05-01), None
patent: 401129517 (1989-05-01), None
patent: WO96/38710 (1996-12-01), None
patent: WO98/15799 (1998-04-01), None
patent: WO 00/68640 (2000-11-01), None
patent: WO 01/44823 (2001-06-01), None
patent: WO 01/74708 (2001-10-01), None
Barbour, N. et al., “Micromechanical Silicon Instrument and Systems Development at Draper Laboratory,” 1996, ALAA Guidance, Navigation and Control Conference, 1-7.
Fujita, T. et al., “Disk-shaped bulk micromachined gyroscope with vacuum sealing,” 2000, Sensors and Actuators, 82:198-204.
Johnson, J.D. et al., “Surface Micromachined Angular Rate Sensor,” A1995 SAE Conference, Paper No. 950538, pp. 77-83.
Putty, M.W. et al., “A Micromachined Vibrating Ring Gyroscope,” 1994, Center for Integrated Sensors and Circuits, 213-220.
Skulski, J. et al., “Planar Resonator Sensor for Moisture Measurements,” May 20-22, 1998, Microwaves and Radar, 12thInternational Conference on MIKON, 3:692-695.
T.K. Tang et al., “Silicon Bulk Micromachined Vibratory Gyroscope,” Solid State Sensor and Actuator Workshop, Transducer Research Foundation, Hilton Head, South Carolina, Jun. 2-6, 1996, 6 pgs.
D. Wright et al., “The HRG Applied to a Satellite Attitude Reference System,” Guidance and Control, American Astronautical Society, Advances in Astronautical Sciences, 1994, 86:1-13.
Wright t al., “The HRG Applied to a Satellite Attitude Reference System,” Guidance and Control, AASAAS, 1994, 86:1-13.
Putty et al., “A Micromachined Vibrating Ring Gyroscope,” Solid State Sensor and Actuator Workshop, Transducer Research Foundation, Hilton Head, 1994, pp. 213-220.
Tang et al., “A Packaged Silicon MEMS Vibratory Gyroscope for Microspacecraft,” Proceedings IEEE, 10thAnnual Int. Workshop on MEMS, Japan, 1997, pp. 500-505.
Barbour et al., “Micromechanical Silicon Instrument and Systems Development at Draper Laboratory,” AIAA Guidance Navigation and Control Conference, 1996, Paper No. 96-3709.
Johnson et al., “Surface Micromachined Angular Rate Sensor,” A1995 SAE Conference, Paper No. 950538, pp. 77-83.
Fujita et al., “Disk-shaped bulk micromachined gyroscope with vacuum sealing,” Sensors and Actuators A:Physical, vol. 82, May 2000, pp. 198-204.
Skulski et al., “Planar resonator sensor for moisture measurements”, Microwaves and Radar, 1998, MIKON '98, 12th International Conf., vol. 3, May 20-22, 1998, pp. 692-695.
Bae Youngsam
Challoner A. Dorian
Hayworth Ken J.
Peay Chris S.
Shcheglov Kirill V.
Ahmed Shamim
California Institute of Technology
Canady & Lortz LLP
Lortz Bradley K.
The Boeing Company
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