Multiple integrated circuit interconnection arrangement

Electricity: electrical systems and devices – Electrostatic capacitors – Fixed capacitor

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174254, 361400, H05K 100

Patent

active

051269201

ABSTRACT:
A flexible chip interconnection includes a flexible film having interconnection lines formed on opposite sides thereof, with selected of the interconnection lines from one side connected by through-film conductors to interconnection lines on the other side. Insulating layers cover both sets of interconnection lines. Multi-chip circuits can be formed on the film with the interconnection lines directly connecting the chips.

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patent: 4438847 (1984-03-01), Fritz
patent: 4472876 (1984-09-01), Nelson
patent: 4480288 (1984-10-01), Gazdik et al.
patent: 4484215 (1984-11-01), Pappas
patent: 4587596 (1986-05-01), Bunnell
IBM Technical Disclosure Bulletin, vol. 24, No. 2, Jul 1981, L. V. Auletta et al.

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