Multiple frequency processing to minimize manufacturing variabil

Details Multiple frequency processing to minimize manufacturing variabil Multiple frequency processing to minimize manufacturing variabil

1996-11-08

2000-08-15

Evans, Geoffrey S.

Electric heating

Metal heating

By arc

21912161, 427554, B23K 2600

Patent

active

061039926

ABSTRACT:
A method for forming a through-via in a laminated substrate by laser drilling the through-via in a laminated substrate from a top exposed surface of the substrate to a bottom exposed surface of the substrate using a plurality of laser pulses that are trepanned in a first predetermined pattern. Each pulse trepanned in the first predetermined pattern has a first energy density per pulse. Then, the through-via is laser drilled using a plurality of laser pulses that are trepanned in a second predetermined pattern. Each pulse trepanned in the second predetermined pattern has a second energy density per pulse that is greater than the first energy density per pulse. The second predetermined pattern is within the first predetermined pattern.

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