Multiple frequency processing to minimize manufacturing variabil

Details Multiple frequency processing to minimize manufacturing variabil Multiple frequency processing to minimize manufacturing variabil

1999-06-24

2000-10-17

Lam, Cathy F.

Stock material or miscellaneous articles

Structurally defined web or sheet

Discontinuous or differential coating, impregnation or bond

216 18, 216 20, 216 65, 174262, B32B 300

Patent

active

061328537

ABSTRACT:
A method for forming a through-via in a laminated substrate by laser drilling the through-via in a laminated substrate from a top exposed surface of the substrate to a bottom exposed surface of the substrate using a plurality of laser pulses that are trepanned in a first predetermined pattern. Each pulse trepanned in the first predetermined pattern has a first energy density per pulse. Then, the through-via is laser drilled using a plurality of laser pulses that are trepanned in a second predetermined pattern. Each pulse trepanned in the second predetermined pattern has a second energy density per pulse that is greater than the first energy density per pulse. The second predetermined pattern is within the first predetermined pattern.

REFERENCES:
patent: 3953566 (1976-04-01), Gore
patent: 3999004 (1976-12-01), Chirino et al.
patent: 4348253 (1982-09-01), Subbarao et al.
patent: 4437109 (1984-03-01), Anthony et al.
patent: 4445978 (1984-05-01), Whartenby et al.
patent: 4473737 (1984-09-01), Anthony
patent: 4482516 (1984-11-01), Bowman et al.
patent: 4511757 (1985-04-01), Ors et al.
patent: 4547836 (1985-10-01), Anthony
patent: 4563543 (1986-01-01), Kersuzan et al.
patent: 4595428 (1986-06-01), Anthony et al.
patent: 4602318 (1986-07-01), Lassen
patent: 4647476 (1987-03-01), Anthony
patent: 4705762 (1987-11-01), Ota et al.
patent: 4720308 (1988-01-01), Anthony et al.
patent: 4896944 (1990-01-01), Irwin et al.
patent: 4901136 (1990-02-01), Neugebauer et al.
patent: 4913656 (1990-04-01), Gordon et al.
patent: 4943032 (1990-07-01), Zdeblick
patent: 4954313 (1990-09-01), Lynche
patent: 4959119 (1990-09-01), Lantzer
patent: 4985296 (1991-01-01), Mortimer, Jr.
patent: 5009607 (1991-04-01), Gordon et al.
patent: 5019997 (1991-05-01), Haller
patent: 5071359 (1991-12-01), Arnio et al.
patent: 5073687 (1991-12-01), Inagawa et al.
patent: 5091339 (1992-02-01), Carey
patent: 5108785 (1992-04-01), Lincoln et al.
patent: 5126532 (1992-06-01), Inagawa et al.
patent: 5171964 (1992-12-01), Booke et al.
patent: 5197184 (1993-03-01), Crumly et al.
patent: 5223692 (1993-06-01), Lozier et al.
patent: 5224265 (1993-07-01), Dux et al.
patent: 5245751 (1993-09-01), Locke et al.
patent: 5251097 (1993-10-01), Simmons et al.
patent: 5293025 (1994-03-01), Wang
patent: 5293626 (1994-03-01), Priest et al.
patent: 5331203 (1994-07-01), Wojnarowski elt al.
patent: 5355397 (1994-10-01), Hanson et al.
patent: 5377404 (1995-01-01), Berg
patent: 5378313 (1995-01-01), Pace
patent: 5378318 (1995-01-01), Weling et al.
patent: 5391516 (1995-02-01), Wojnarowski et al.
patent: 5428803 (1995-06-01), Chen et al.
patent: 5442475 (1995-08-01), Bausman et al.
patent: 5454161 (1995-10-01), Beilin et al.
patent: 5459634 (1995-10-01), Nelson et al.
patent: 5466892 (1995-11-01), Howard et al.
patent: 5509553 (1996-04-01), Hunter, Jr. et al.
patent: 5541367 (1996-07-01), Swamy
patent: 5541731 (1996-07-01), Freedenberg et al.
patent: 5593606 (1997-01-01), Owen et al.
patent: 5744780 (1998-04-01), Chang et al.
patent: 5841102 (1998-11-01), Noddin
patent: 5910255 (1999-06-01), Noddin
Article, Lizotte et al., "Laser drillings speeds BGA packaging", Solid State Technology, Sep. 1996, 120-128.
Article, Eskew et al., "A Laser drill and patterning system for low cost, rapid prototyping", ICEMCM '95, p. 314-319.
Brochure, "Impact--Laser Processing Systems", Lumonics Corporation, 4 pages.
Article, Carey, "MCM-L Substrates for a 300 MHZ Workstation", ICEMCM '95, pp. 537-542.
Technical Paper, Kosto et al., "Low Cost Through-Hole Activation Method for PTFE Based Substrates", IPC, P6-5-1 through P6-5-8.
Article, Jain et al., "Large-Area, High Throughput, High-Resolution Patternmaking and Via-Drilling System", ICEMCM 1995 p. 327-335.
Article, Lemke, "Recent Developments in the Production and Application of Advanced laminate Based MCMs and Chip Carriers", ICEMCM 1995 p. 235-240.
Article, Freda et al. "Laminate Based Substrates in Semiconductors Packages", ICEMCM '95, pp. 559-566.

Affiliated with

Also associated with

Rating

Multiple frequency processing to minimize manufacturing variabil does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Multiple frequency processing to minimize manufacturing variabil, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Multiple frequency processing to minimize manufacturing variabil will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-466271