Multiple-fan microprocessor cooling through a finned heat pipe

Details Multiple-fan microprocessor cooling through a finned heat pipe Multiple-fan microprocessor cooling through a finned heat pipe

1993-02-12

1994-08-16

Thompson, Gregory D.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

16510433, 174 152, H05K 720

Patent

active

053392140

ABSTRACT:
A computer chassis assembly that includes a heat pipe which thermally couples an electronic package to multiple fan units. The heat pipe provides a computer chassis that sufficiently cools internal heat generating components without placing the components in close proximity to the fans.

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