Multiple die interconnect system

Details Multiple die interconnect system Multiple die interconnect system

2005-04-19

2005-04-19

Zarneki, David A. (Department: 2827)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S803000

Reexamination Certificate

active

06882546

ABSTRACT:
A multiple integrated circuit (IC) die assembly includes a base IC die and secondary IC dice mounted on a surface of the base IC die. A set of protruding contacts formed on the surface of the base IC die and extending beyond the secondary IC dice link the surface of the base IC die to a printed circuit board (PCB) substrate with the secondary IC die residing between the base IC die and the PCB substrate.

REFERENCES:
patent: 5969952 (1999-10-01), Hayashi et al.
patent: 6330164 (2001-12-01), Khandros et al.
patent: 0638931 (1995-02-01), None
patent: 1067602 (2001-10-01), None
patent: 2297652 (1996-08-01), None

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